Specific Process Knowledge/Thin film deposition/Deposition of Palladium: Difference between revisions

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! Pre-clean
! Pre-clean
|Ar ion source
|Ar ion source
|RF Ar clean
|none
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
|10 Å - 1 µm*
|10 Å - 600 nm*
|10 Å to 200 nm
|10 Å - 600 nm*
|-
|-
|-style="background:Lightgrey; color:black"
|-style="background:Lightgrey; color:black"
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*smaller wafers and pieces
*smaller wafers and pieces
|
|
*1x 2" wafer or
*Up to 6x6" wafers (deposition on one wafer at the time)
*1x 4" wafers or
*Up to 6x4" wafers (deposition on one wafer at the time)
*Several smaller pieces  
*smaller wafers and pieces
|-
|-
|-style="background:Lightgrey; color:black"
|-style="background:Lightgrey; color:black"
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*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
|
|
* Silicon oxide
*Silicon oxide
* Silicon (oxy)nitride
*Silicon (oxy)nitride
* Photoresist
*Photoresist
* PMMA
*PMMA
* Mylar  
*Mylar
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"

Revision as of 13:21, 3 October 2021

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Palladium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment:


E-beam evaporation (Temescal) E-beam evaporation (Wordentec)
General description E-beam deposition of Pd E-beam deposition of Pd
Pre-clean Ar ion source none
Layer thickness 10 Å - 600 nm* 10 Å - 600 nm*
Deposition rate 0.5 Å/s to 10Å/s 2 Å/s to 10Å/s
Batch size
  • Up to 4x6" wafers
  • Up to 3x8" wafers (ask for holder)
  • smaller wafers and pieces
  • Up to 6x6" wafers (deposition on one wafer at the time)
  • Up to 6x4" wafers (deposition on one wafer at the time)
  • smaller wafers and pieces
Allowed materials
Comment

* If depositing more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.

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