Specific Process Knowledge/Thin film deposition/Sputter deposition of oxides and other compounds: Difference between revisions
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Metal oxides which may be sputter deposited but cannot be deposited by other methods here at Nanolab include: | Metal oxides which may be sputter deposited but cannot be deposited by other methods here at Nanolab include: | ||
BaTiO<sub>3</sub> (deposited with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) | BaTiO<sub>3</sub> (deposited with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) <br/> | ||
Cr<sub>2</sub>O<sub>3</sub> (deposited several times with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) | Cr<sub>2</sub>O<sub>3</sub> (deposited several times with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) <br/> | ||
MgO (deposited with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) | MgO (deposited with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) | ||
NiO (extensively deposited with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) | <br/> | ||
Ta<sub>2</sub>O<sub>5</sub> (deposited several times with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) | NiO (extensively deposited with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) <br/> | ||
VO<sub>x</sub> (deposited several times with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) | Ta<sub>2</sub>O<sub>5</sub> (deposited several times with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) <br/> | ||
YSZ (Yttrium stabilized zirconia) | VO<sub>x</sub> (deposited several times with the Sputter-System (Lesker), see [http://labmanager.dtu.dk/function.php?module=Processlog&view=editlog&machid=244 process log]) <br/> | ||
YSZ (Yttrium stabilized zirconia) <br/> | |||
You are welcome to contact us with requests for other materials. | You are welcome to contact us with requests for other materials. |
Revision as of 22:05, 10 August 2020
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Sputter deposition of oxides
Some metal oxides are well suited for sputter deposition. Below you can compare the sputter systems available here at Nanolab for depositing them. We often start with a metal target and deposit the material
This page is a collective page for metal oxides that we do not deposit by any other methods. Other metal oxides that may be deposited both by sputtering and other methods are described on their own individual pages (see the thin film main page).
Metal oxides which may be sputter deposited but cannot be deposited by other methods here at Nanolab include:
BaTiO3 (deposited with the Sputter-System (Lesker), see process log)
Cr2O3 (deposited several times with the Sputter-System (Lesker), see process log)
MgO (deposited with the Sputter-System (Lesker), see process log)
NiO (extensively deposited with the Sputter-System (Lesker), see process log)
Ta2O5 (deposited several times with the Sputter-System (Lesker), see process log)
VOx (deposited several times with the Sputter-System (Lesker), see process log)
YSZ (Yttrium stabilized zirconia)
You are welcome to contact us with requests for other materials.
Comparison of sputter deposition options for metal oxides
Sputter deposition (Sputter-System (Lesker)) | Sputter deposition (Sputter-system Metal-Oxide (PC1)) | |
---|---|---|
General description |
Sputter deposition in chamber with 6 x 2" sputter guns at a slight angle to the substrate. |
Sputter deposition in chamber with 6 x 3" sputter guns for metal and oxide deposition. Targets at a sligth angle to the substrate. |
Pre-clean | RF Ar clean | RF Ar clean |
Target (source material) size | 2" | 3" |
Power supply options | DC and RF | DC, RF, Pulsed DC, and HiPIMS |
Batch size |
|
|
Pumping time from wafer load |
Approx. 10 min |
Approx. 11 min |
Allowed materials |
|
|
Other options |
Source with high-strength magnet available for magnetic oxides |
Source with high-strength magnet available for magnetic oxides |
Comments | Has been used for many oxides with varying degrees of success. You are welcome to request your material of choice. This is our old workhorse and is a relatively dirty system but works very well for many applications. | We expect that this system will be used for many oxides. You are welcome to request your material of choice. This is our new system for larger batches and more demanding materials. It is also for normal sputtering needs to complement our old Sputter System (Lesker). |