Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
→Nickel deposition: edited limits for permission |
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! Layer thickness | ! Layer thickness | ||
| | |10 Å to 1 µm * | ||
| | |10 Å to 1 µm * | ||
| | |10 Å to 2000 Å | ||
| | |10 Å to 5000 Å ** | ||
| | |10 Å to 5000 Å ** | ||
|~20 µm to ~1000 µm | |~20 µm to ~1000 µm | ||
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*Thicknesses above 2000 Å requires special permission | *Thicknesses above 2000 Å requires special permission | ||
| | | | ||
|May use high-strength magnet for deposition | | | ||
|May use high-strength magnet for deposition | *May use high-strength magnet for deposition. | ||
*Thicknesses above 2000 Å require special permission | |||
| | |||
*May use high-strength magnet for deposition | |||
*Thicknesses above 2000 Å require special permission | |||
|Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary. | |Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary. | ||
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'''*''' ''To deposit layers thicker than 600 | '''*''' ''To deposit layers thicker than 600 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine'' | ||
'''**''' ''To deposit layers thicker than 200 nm permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine'' | |||