Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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* Photoresist | * Photoresist | ||
* Metals | * Metals | ||
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*Almost any that do not outgas if you plan to use substrate heating. Check the cross-contamination sheets in Labmanager. | |||
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Base materials:<br> | Base materials:<br> | ||
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|May use high-strength magnet for deposition | |||
|Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary. | |Sample must be compatible with plating bath (pH = 3,65 and T = 52°C). Seed metal necessary. | ||
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'''*''' ''To deposit layers thicker than 600 nanometers permission is required from metal@ | '''*''' ''To deposit layers thicker than 600 nanometers permission is required from metal@nanolab.dtu.dk to ensure enough material is present in the machine'' | ||