Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride: Difference between revisions
Line 7: | Line 7: | ||
Thin films of Titanium Nitride (TiN) can be deposited by either [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD]] or [[Specific Process Knowledge/Thin film deposition/Lesker|reactive sputtering]] methods. If sputtering method is used the target is Ti and nitrogen (N<sub>2</sub>) is added as reactive gas to the chamber resulting the formation of Titanium Nitride on the sample. The process information is available below: | Thin films of Titanium Nitride (TiN) can be deposited by either [[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)|ALD]] or [[Specific Process Knowledge/Thin film deposition/Lesker|reactive sputtering]] methods. If sputtering method is used the target is Ti and nitrogen (N<sub>2</sub>) is added as reactive gas to the chamber resulting the formation of Titanium Nitride on the sample. The process information is available below: | ||
*[[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|TiN deposition using ALD]]. | *[[Specific Process Knowledge/Thin film deposition/ALD2 (PEALD)/TiN deposition using ALD2|TiN deposition using ALD]]. |
Revision as of 15:05, 6 April 2020
Feedback to this page: click here
Deposition of Titanium Nitride
Thin films of Titanium Nitride (TiN) can be deposited by either ALD or reactive sputtering methods. If sputtering method is used the target is Ti and nitrogen (N2) is added as reactive gas to the chamber resulting the formation of Titanium Nitride on the sample. The process information is available below:
Comparison between sputtering and ALD methods for deposition of Titanium Nitride.
ALD2 | Sputter System Lesker | |
---|---|---|
Generel description |
|
|
Stoichiometry |
|
|
Film Thickness |
|
|
Deposition rate |
|
|
Step coverage |
|
|
Process Temperature |
|
|
Substrate size |
|
|
Allowed materials |
|
|