Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
No edit summary |
No edit summary |
||
Line 46: | Line 46: | ||
== Comments: | == Comments: Choise of equipment == | ||
[[Thick layers]] | [[Thick layers]] | ||
== Comments: Adhesion layer == | |||
[[Ti as adhesion layer]] |
Revision as of 10:52, 11 March 2009
Titanium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | |
---|---|---|---|---|
Batch size |
|
|
|
|
Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 1 µm | . |
Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 10Å/s to 15Å/s | . |