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| | TiW alloy: 10%/90% by weight | | | TiW alloy: 10%/90% by weight |
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| ==Deposited film characteristics==
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| AFM pictures show how the surface roughness is dependent on the process parameters.
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| For the sputter process, the effect and argon pressure can be set to different values. Depending on the process parameters, the deposited layers will have different characteristics: the roughness, grain size and uniformity may be differnt.
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| '''Effect 150 W, pressure 1*10<sup>-3</sup> mbar'''
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| With use of the settings 150W and 1*10<sup>-3</sup> mbar, a surface with low roughness is deposited.
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| [[Image:Tiw 150W 0 001 nr2.jpg|480x480px|center|thumb|AFM picture of sputter deposited TiW. Used settings: 150W and 1*10<sup>-3</sup> mbar.]]
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| ''Measurement done September 2008, KNIL.''
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