Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions
| Line 8: | Line 8: | ||
Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness. | Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness. | ||
'''Do not use the power more than | '''Do not use the power more than 180 W without consulting staff''', since the Si target could break into a lot of small pieces. | ||
{| border="1" cellspacing="0" cellpadding="4" | {| border="1" cellspacing="0" cellpadding="4" | ||
| Line 35: | Line 35: | ||
|- | |- | ||
|} | |} | ||
In November 2018 we (reet/paphol) tested Si sputter deposition in the Wordentec at 500 W with a low sputter pressure of 2*10<sup>-3</sup> mbar together with Yannick Seis. The aim was a better uniformity of the sputtered film. See details in the process log. It is thus possible to use a higher power together with a lower pressure, but please do not do this without consulting the Thin Film group. | |||
Revision as of 12:42, 18 March 2020
Silicon sputter
Silicon can be sputter deposited in Wordentec.
Parameters
Listed below are tried parameters, that can be used during deposition. The process parameters in the table below can be used as started values, run a test process to be sure that you get the right thickness.
Do not use the power more than 180 W without consulting staff, since the Si target could break into a lot of small pieces.
| Settings 1 | Settings 2 | |
|---|---|---|
| Process type | Sputtering | Sputtering |
| Power | 130W | 170W |
| Sputter pressure | 5*10-3 mbar | 1*10-2 mbar |
| Rate | About 0.7 Å/s | About 0.6 Å/s |
In November 2018 we (reet/paphol) tested Si sputter deposition in the Wordentec at 500 W with a low sputter pressure of 2*10-3 mbar together with Yannick Seis. The aim was a better uniformity of the sputtered film. See details in the process log. It is thus possible to use a higher power together with a lower pressure, but please do not do this without consulting the Thin Film group.