Specific Process Knowledge/Thin film deposition/Deposition of Silver/Deposition of Silver: Difference between revisions
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These settings were fond to give a fairly stabel deposition rate: | These settings were fond to give a fairly stabel deposition rate: | ||
Max power 6. | Max power 6.6 % | ||
Soak power 1 : 4 % | Soak power 1 : 4 % | ||
Soak power 2 : 6. | Soak power 2 : 6.6 % | ||
Soak time 2: 1 min (can be set to for example 2 min, if a higher stability of the deposition rate is requested). | Soak time 2: 1 min (can be set to for example 2 min, if a higher stability of the deposition rate is requested). | ||
Deposition rate: (requested) '''5 | Deposition rate: (requested) '''2.5 Å/s''' | ||
Density : 10.5 (thermal evap. of Al, 2.7) | Density : 10.5 (thermal evap. of Al, 2.7) | ||
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Actual value of deposition rate flucturate, staring at about 1 Å/s, going up to maximum | Actual value of deposition rate flucturate, staring at about 1 Å/s, going up to maximum 3 Å/s, and flucturating between 2-3 Å/s after a while. | ||
15 pellets (1/8" diameter x 1/8" long) were placed in the boat before the evaporation processes were started. More than 8500 Å could be deposited from that amount, without any problem with covered contacts or smilar things. | 15 pellets (1/8" diameter x 1/8" long) were placed in the boat before the evaporation processes were started. More than 8500 Å could be deposited from that amount, without any problem with covered contacts or smilar things. | ||
Revision as of 12:51, 30 January 2009
Thermal deposition of Silver
Note: This text is under construction
Silver can be thermally evaporated in Wordentec. The deposition rate is highly sensitive to the process parameters (at least for a requested deposition rate of 5 Å/s).
Therefore, different settings have been tested, to find a situation with rather stabel depositon rate.
These settings were fond to give a fairly stabel deposition rate:
Max power 6.6 %
Soak power 1 : 4 %
Soak power 2 : 6.6 %
Soak time 2: 1 min (can be set to for example 2 min, if a higher stability of the deposition rate is requested).
Deposition rate: (requested) 2.5 Å/s
Density : 10.5 (thermal evap. of Al, 2.7) Z-ratio : 0.529 (thermal evap. of Al 1.08)
Tooling factor should be set to: (to get the requested layer thickness on the wafer).
Actual value of deposition rate flucturate, staring at about 1 Å/s, going up to maximum 3 Å/s, and flucturating between 2-3 Å/s after a while.
15 pellets (1/8" diameter x 1/8" long) were placed in the boat before the evaporation processes were started. More than 8500 Å could be deposited from that amount, without any problem with covered contacts or smilar things.