Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
Silver can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment. | ||
| Line 6: | Line 6: | ||
! E-beam evaporation (Alcatel) | ! E-beam evaporation (Alcatel) | ||
! E-beam evaporation (Leybold) | ! E-beam evaporation (Leybold) | ||
! Thermal deposition (Wordentec) | |||
|- | |- | ||
| Batch size | | Batch size | ||
| Line 14: | Line 15: | ||
*8x4" wafers or | *8x4" wafers or | ||
*5x6" wafers | *5x6" wafers | ||
| | |||
*6x6" wafers or | |||
*6x4" wafers or | |||
*24x2" wafers or | |||
|- | |- | ||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|Ar ion bombartment | |Ar ion bombartment | ||
|Ar clean | |||
|- | |- | ||
| Layer thickness | | Layer thickness | ||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 0.5µm | |10Å to 0.5µm | ||
|10Å to 0.5µm (not on all wafers) | |||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|1Å/s to 5Å/s | |1Å/s to 5Å/s | ||
|1Å to 10 Å/s | |||
|- | |- | ||
|} | |} | ||
Revision as of 09:46, 29 January 2009
Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | Thermal deposition (Wordentec) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 0.5µm (not on all wafers) |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 1Å to 10 Å/s |
Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec