Specific Process Knowledge/Etch/DRIE-Pegasus/Etch silicon nanostructures: Difference between revisions
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Based on the so called DREM process, there are two recipes on DRIE-Pegasus 1 which are suitable for etching silicon nanostructures. The recipes are called '''DREM 1kW nano''' and '''DREM 0.5kW nano''' | Based on the so called DREM process, there are two recipes on DRIE-Pegasus 1 which are suitable for etching silicon nanostructures. The recipes are called '''DREM 1kW nano''' and '''DREM 0.5kW nano'''. In '''DREM 1kW nano''' a higher coil power and larger gas flow rates are applied, making it suitable for etching high aspect ratio nanostructures (AR around 25 can be achieved depending on the patterns and resist used). In '''DREM 0.5kW nano''' both the coil power and gas flow rates are reduced, thus the scallop size can be reduced remarkably down to 16nm, giving a smooth sidewall on the nanostructures, while the aspect ratio can be limited. | ||
Revision as of 07:25, 26 April 2019
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Based on the so called DREM process, there are two recipes on DRIE-Pegasus 1 which are suitable for etching silicon nanostructures. The recipes are called DREM 1kW nano and DREM 0.5kW nano. In DREM 1kW nano a higher coil power and larger gas flow rates are applied, making it suitable for etching high aspect ratio nanostructures (AR around 25 can be achieved depending on the patterns and resist used). In DREM 0.5kW nano both the coil power and gas flow rates are reduced, thus the scallop size can be reduced remarkably down to 16nm, giving a smooth sidewall on the nanostructures, while the aspect ratio can be limited.