Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
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![[Specific Process Knowledge/Etch/Wet Chromium Etch|Cr wet etch | ![[Specific Process Knowledge/Etch/Wet Chromium Etch|Cr wet etch]] | ||
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]] | ![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]] | ||
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]] | ![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]] | ||
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!Generel description | !Generel description | ||
|Wet etch of Cr premixed (Chrome etch 18) | |Wet etch of Cr premixed (Chrome etch 18) | ||
|Dry plasma etch of Cr | |Dry plasma etch of Cr | ||
|Sputtering of Cr - pure physical etch | |Sputtering of Cr - pure physical etch | ||
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*~?nm/min | *~?nm/min | ||
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*~14 nm/min (depending on features size and etch load) | *~14 nm/min (depending on features size and etch load) | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Etch profile | !Etch profile | ||
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*Isotropic | *Isotropic | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Substrate size | !Substrate size | ||
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*Any size and number that can go inside the beaker in use | *Any size and number that can go inside the beaker in use | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!'''Allowed materials''' | !'''Allowed materials''' | ||
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No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals | No restrictions cross contamination wise as long as you use the right beaker and make sure that they are safe to enter in the chemicals | ||