Specific Process Knowledge/Thin film deposition/Deposition of Niobium: Difference between revisions
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Revision as of 09:31, 24 September 2018
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Deposition of Nb
Niobium can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the deposition equipment.
E-beam evaporation (Temescal) | Sputter deposition (Lesker) | |
---|---|---|
General description | E-beam deposition of Nb
(line-of-sight deposition) |
Sputter deposition of Nb
(not line-of-sight deposition) |
Pre-clean | Ar ion bombardment | RF Ar clean |
Layer thickness | 10Å to 1µm* | 10Å to 1µm** |
Deposition rate | 0.5Å/s to 3Å/s | ~1Å/s |
Batch size |
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|
Allowed materials |
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Comment | Substrates will get heated during a longer deposition. During a 100 nm deposition at 2 Å/s, the substrate reached about 105 °C. |
** To deposit layers thicker than 600 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)
* To deposit layers thicker than 200 nm permission is required to ensure that there is enough metal (contact metal@danchip.dtu.dk)