Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions
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== Tin deposition == | |||
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is being decommissioned, but has not yet been evaporated in the Physimeca or the Temescal, which we have now (August 2018) | |||
Tin can be deposited by e-beam evaporation. | |||
{| border="1" cellspacing="0" cellpadding="3" | {| border="1" cellspacing="0" cellpadding="3" | ||
|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/ | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! General description | ! General description | ||
| E-beam deposition of Sn | | E-beam deposition of Sn | ||
(line-of-sight deposition) | |||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
!Pre-clean | !Pre-clean | ||
| | |Ar ion clean | ||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
| Line 25: | Line 25: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
| | |1Å/s to 10Å/s | ||
|- | |- | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Pre-clean | !Pre-clean | ||
| | |Ar ion bombardment | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Batch size | ! Batch size | ||
| | | | ||
*Up to | *Up to 4x6" wafers | ||
*Up to 3x8" wafers (ask for holder) | |||
*small pieces | *small pieces | ||
|- | |- | ||
| Line 45: | Line 46: | ||
| | | | ||
* Silicon | * Silicon | ||
* Silicon oxide | *Silicon oxide | ||
* Silicon (oxy)nitride | *Silicon (oxy)nitride | ||
* Photoresist | *Photoresist | ||
* PMMA | *PMMA | ||
* Mylar | *Mylar | ||
* | *Metals | ||
* | *See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet] | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Comment | ! Comment | ||
| | | Tin has not yet been deposited in the Temescal to date (August 2018). | ||
Please contact the Thin Film group if you would like us to develop the process. | |||
|} | |} | ||
'''*''' ''For thicknesses above | '''*''' ''For thicknesses above 600 nm permission is required.'' | ||