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Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

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→Platinum deposition: Replaced Alcatel with Temescal and adjusted params
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
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! Pre-clean
! Pre-clean


|RF Ar clean
|Ar ion source
|RF Ar clean
|RF Ar clean
|
|
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
|10Å to 5000Å*  
|10Å - 1µm*
|10Å to 5000Å*
|10Å to 5000Å*
|10Å to 2000Å
|10Å to 2000Å
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
|2Å/s to 15Å/s
|0.5Å/s to 10Å/s
|10Å/s to 15Å/s
|10Å/s to 15Å/s
|10Å/s
|10Å/s
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! Batch size
! Batch size
|
|
*Up to 1x4" wafers
*Up to 4x6" wafers
*smaller pieces
*Up to 3x8" wafers (ask for holder)
*smaller wafers and pieces
|
|
*24x2" wafers or  
*24x2" wafers or  
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|
|
* Silicon
|
* Silicon oxide  
*Silicon oxide
* Silicon (oxy)nitride  
*Silicon (oxy)nitride
* Photoresist  
*Photoresist
* PMMA  
*PMMA
* Mylar  
*Mylar
* SU-8
*Metals
* Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
|
|
* Silicon
* Silicon
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Comment
! Comment
|
| As of August 2018, Pt has not yet been deposited in the Temescal. Please contact the Thin Film group to develop a process.
|
|
|
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|}
|}


'''*''' ''For thicknesses above 200 nm permission is required from Thin Film group.''
'''*''' ''If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.''
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Platinum"