Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions
→Platinum deposition: Replaced Alcatel with Temescal and adjusted params |
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/ | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ||
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! Pre-clean | ! Pre-clean | ||
| | |Ar ion source | ||
|RF Ar clean | |RF Ar clean | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|10Å | |10Å - 1µm* | ||
|10Å to 5000Å* | |10Å to 5000Å* | ||
|10Å to 2000Å | |10Å to 2000Å | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
| | |0.5Å/s to 10Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|10Å/s | |10Å/s | ||
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! Batch size | ! Batch size | ||
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*Up to | *Up to 4x6" wafers | ||
*smaller pieces | *Up to 3x8" wafers (ask for holder) | ||
*smaller wafers and pieces | |||
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*24x2" wafers or | *24x2" wafers or | ||
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* Silicon oxide | *Silicon oxide | ||
* Silicon (oxy)nitride | *Silicon (oxy)nitride | ||
* Photoresist | *Photoresist | ||
* PMMA | *PMMA | ||
* Mylar | *Mylar | ||
* | *Metals | ||
* | *See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet] | ||
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* Silicon | * Silicon | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
| | | As of August 2018, Pt has not yet been deposited in the Temescal. Please contact the Thin Film group to develop a process. | ||
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'''*''' '' | '''*''' ''If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.'' | ||
Revision as of 12:38, 29 August 2018
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Platinum deposition
Platinum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Temescal) | E-beam evaporation (Wordentec) | E-beam evaporation (Physimeca) | Sputter deposition (Lesker) | ||
|---|---|---|---|---|---|
| General description | E-beam deposition of Pt | E-beam deposition of Pt | E-beam deposition of Pt | Sputter deposition of Pt | |
| Pre-clean | Ar ion source | RF Ar clean | RF Ar clean | ||
| Layer thickness | 10Å - 1µm* | 10Å to 5000Å* | 10Å to 2000Å | 10Å to 5000Å | |
| Deposition rate | 0.5Å/s to 10Å/s | 10Å/s to 15Å/s | 10Å/s | ? Å/s to ? Å/s | |
| Batch size |
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| Allowed materials |
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| Comment | As of August 2018, Pt has not yet been deposited in the Temescal. Please contact the Thin Film group to develop a process. |
* If depositing a total of more than 600 nm, please write to metal@danchip.dtu.dk well in advance to ensure that enough material is present.