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Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions

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Nickel deposition: removed Alcatel, added Temescal
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]])
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|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|RF Ar clean
|Ar ion bombardment
|RF Ar clean
|RF Ar clean
|
|
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! Layer thickness
! Layer thickness
|10Å to 5000 Å*
|10Å to 1 µm*
|10Å to 1 µm*
|10Å to 1 µm*
|10Å to 2000 Å
|10Å to 2000 Å
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! Deposition rate
! Deposition rate
|2Å/s to 15Å/s
|2Å/s to 10Å/s
|10Å/s to 15Å/s
|10Å/s to 15Å/s
|1 to 10Å/s
|1 to 10Å/s
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! Batch size
! Batch size
|
|
*Up to 1x4" wafers
*Up to 4x6" wafers
*smaller pieces
*Up to 3x8" wafers (ask for holder)
*Many smaller pieces
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*24x2" wafers or  
*24x2" wafers or  
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* Silicon
* Silicon
* Silicon oxide  
*Silicon oxide
* Silicon (oxy)nitride  
*Silicon (oxy)nitride
* Photoresist  
*Photoresist
* PMMA  
*PMMA
* Mylar  
*Mylar
* SU-8
*Metals
* Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
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* Silicon
* Silicon
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|}
|}


'''*''' ''To deposit layers thicker then 2000 Å permission is required (contact Thin film group)''
'''*''' ''To deposit layers thicker then 600 microns permission is required from metal@danchip.dtu.dk to ensure enough material is present in the machine''