Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
→Thermal deposition of Aluminium: Added Temescal to comparative chart, added pumping times, and added Physimeca |
|||
| Line 33: | Line 33: | ||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/ | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | |||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
| Line 42: | Line 43: | ||
! General description | ! General description | ||
| | |||
E-beam deposition of Aluminium | |||
| | | | ||
E-beam deposition of Aluminium | E-beam deposition of Aluminium | ||
| Line 55: | Line 58: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | ! Pre-clean | ||
| | |Ar ion etch | ||
|None | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
| Line 63: | Line 67: | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|10Å to | |10Å to 1 µm* | ||
|10Å to 0.5 µm ** | |||
|10Å to 1 µm* | |10Å to 1 µm* | ||
|10Å to ~0.5µm (very time consuming ) | |10Å to ~0.5µm (very time consuming ) | ||
|10Å to 0.5 µm (this uses all Al in the boat) | |10Å to 0.5 µm** (this uses all Al in the boat) | ||
|10Å to 0.5 µm | |10Å to 0.5 µm** | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
| | |0.5Å/s to 15Å/s | ||
|0.5Å/s to 15Å/s | |||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s | |Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s | ||
| Line 79: | Line 85: | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | ! Batch size | ||
| | |||
*Up to 4x6" or 3x8" wafers | |||
*smaller pieces | |||
| | | | ||
*Up to 1x4" wafers | *Up to 1x4" wafers | ||
| Line 98: | Line 107: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pumping time from wafer load | |||
| | |||
Approx. 20 min | |||
| | |||
Approx. 10 min | |||
| | |||
Approx. 1 hour | |||
| | |||
Approx. 1 hour | |||
| | |||
Approx. 1 hour | |||
| | |||
Approx. 15 min | |||
|-style="background:WhiteSmoke; color:black" | |||
! Allowed substrates | ! Allowed substrates | ||
| Line 125: | Line 150: | ||
* Pyrex wafers | * Pyrex wafers | ||
| | |||
* Silicon wafers | |||
* Quartz wafers | |||
* Pyrex wafers | |||
|-style="background: | |-style="background:LightGrey; color:black" | ||
!Allowed materials | !Allowed materials | ||
| | | | ||
| Line 137: | Line 166: | ||
* Metals | * Metals | ||
| | |||
* Silicon oxide | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
| | | | ||
| Line 175: | Line 212: | ||
* Metals | * Metals | ||
|-style="background: | |-style="background:WhiteSmoke; color:black" | ||
! Comment | ! Comment | ||
|Thickness above 200 nm: ask for permission | |'''*''' Thickness above 600 nm: ask for permission | ||
|Thickness above | |||
It is possible to tilt the substrate | |||
|'''**''' Thickness above 200 nm: ask for permission | |||
|'''*''' Thickness above 600 nm: ask for permission | |||
| | | | ||
|Thickness above 200 nm: ask for permission | |'''**'''Thickness above 200 nm: ask for permission | ||
|Thickness above 200 nm: ask for permission | |'''**'''Thickness above 200 nm: ask for permission | ||
|} | |} | ||
'''*''' ''For thicknesses above 200 nm permission from ThinFilm group | '''*''' ''For thicknesses above 600 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk'' | ||
'''**''' ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@danchip.dtu.dk'' | |||
==Aluminium deposition on ZEP520A for lift-off== | ==Aluminium deposition on ZEP520A for lift-off== | ||