Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

Revision as of 07:45, 26 August 2008

Deposition of TiW alloy can take place in the Wordentec.

	Sputter deposition (Wordentec)
Batch size	24x2" wafers or 6x4" wafers or 6x6" wafers
Pre-clean	RF Ar clean
Layer thickness	.
Deposition rate	Depending on process parameters, see here.

This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see here) and may change with these settings.

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	This is done by a sputtering process~~, process~~ parameters (argon pressure and effect) can be varied, and the deposition rate and ~~surface roughness~~ may change with these settings.		This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[Sputtering of TiW in Wordentec\|here]]) and may change with these settings.