Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
Line 10: Line 10:
The challenge was to develop a SiO2 etching recipe that can be used for samples on a carrier. Samples that cannot be clamped and cooled. The goal was to keep a good selectivity to the resist mask and get a vertical sidewall, without getting a lot of redeposition on the sidewalls. The testing regime was using both the coil power and the platen power with C4F8 chemistry.  
The challenge was to develop a SiO2 etching recipe that can be used for samples on a carrier. Samples that cannot be clamped and cooled. The goal was to keep a good selectivity to the resist mask and get a vertical sidewall, without getting a lot of redeposition on the sidewalls. The testing regime was using both the coil power and the platen power with C4F8 chemistry.  


[[Image:ASE SiO2 image of development flow 01.jpg|100px]]








*Take a look at development flow and the results here: [[Media:ASE SiO2 etch on carrier ICP C4F8 H2 no He rev02.pdf]]. Zoom in to read and see the images: (Ctrl + "+")
 
*Take a look at development flow and the results here: [[Media:ASE SiO2 etch on carrier ICP C4F8 H2 no He rev02.pdf]] [[Image:ASE SiO2 image of development flow 01.jpg|100px]]. Zoom in to read and see the images: (Ctrl + "+")

Revision as of 13:28, 5 April 2018

Feedback to this page: click here


THIS PAGE IS UNDER CONSTRUCTIONUnder construction.png

Development work: SiO2 etch with resist mask, sample on carrier (Si carrier)

By Berit Herstrøm @danchip, January-Marts 2018

The challenge was to develop a SiO2 etching recipe that can be used for samples on a carrier. Samples that cannot be clamped and cooled. The goal was to keep a good selectivity to the resist mask and get a vertical sidewall, without getting a lot of redeposition on the sidewalls. The testing regime was using both the coil power and the platen power with C4F8 chemistry.