Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Physimeca|Physimeca]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
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! General description | ! General description | ||
|E-beam deposition of Nickel | |E-beam deposition of Nickel | ||
|E-beam deposition of Nickel | |E-beam deposition of Nickel | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|10Å to 5000 Å* | |10Å to 5000 Å* | ||
|10Å to 1 µm* | |10Å to 1 µm* | ||
|10Å to 2000 Å | |10Å to 2000 Å | ||
|10Å to 2000 Å | |10Å to 2000 Å | ||
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|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|1 to 10Å/s | |1 to 10Å/s | ||
|Depends on process parameters. About 1 Å/s | |Depends on process parameters. About 1 Å/s | ||
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*6x4" wafers or | *6x4" wafers or | ||
*6x6" wafers | *6x6" wafers | ||
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*1x 2" wafer or | *1x 2" wafer or | ||
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* Mylar | * Mylar | ||
* SU-8 | * SU-8 | ||
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* Silicon | * Silicon | ||
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*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | *[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | ||
*Thicknesses above 2000 Å requires special permission | *Thicknesses above 2000 Å requires special permission | ||
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