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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Paphol (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
912 edits
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
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! General description
! General description


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E-beam deposition of Aluminium
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|
E-beam deposition of Aluminium
E-beam deposition of Aluminium
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E-beam deposition of Aluminium
E-beam deposition of Aluminium
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Sputter deposition of Aluminium
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|
Sputter deposition of Aluminium
Sputter deposition of Aluminium
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! Pre-clean
! Pre-clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean  
|RF Ar clean  
|RF Ar clean
|RF Ar clean
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|10Å to 1µm*
|10Å to 1µm*
|10Å to 1 µm*
|10Å to 1 µm*
|10Å to 1000 Å
|10Å to about 2000 Å
|10Å to ~0.5µm (very time consuming )
|10Å to ~0.5µm (very time consuming )
|10Å to 0.5 µm (this uses all Al in the boat)
|10Å to 0.5 µm (this uses all Al in the boat)
|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|10Å/s to 15Å/s
|10Å/s to 15Å/s
|About 1Å/s
|Dependent on [[/Sputter rates for Al PVD co-sputter/evaporation|process parameters]] (about 1 Å/s).
|Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s
|Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s
|~2Å/s to 15Å/s
|~2Å/s to 15Å/s
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Batch size
! Batch size
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*6x4" wafers or
*6x4" wafers or
*6x6" wafers
*6x6" wafers
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*12x2" wafers or
*12x4" wafers or
*4x6" wafers
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*12x4" wafers or
*12x4" wafers or
*4x6" wafers
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*24x2" wafers or  
*24x2" wafers or  
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* Pyrex wafers  
* Pyrex wafers  


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* Silicon wafers
* Quartz wafers
* Pyrex wafers
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* Silicon wafers
* Quartz wafers
* Pyrex wafers


|  
|  
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* Metals  
* Metals  


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* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals
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* Silicon oxide
* Silicon (oxy)nitride
* Photoresist
* PMMA
* Mylar
* SU-8
* Metals


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|Thickness above 200 nm: ask for permission
|Thickness above 200 nm: ask for permission
|Thickness above 200 nm: ask for permission
|Thickness above 200 nm: ask for permission
|Only very thin layers (up to 100 nm).
|Al sputter target: 99.995% Al
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