Specific Process Knowledge/Thin film deposition/ALD Picosun R200/ALD multilayers: Difference between revisions
Line 51: | Line 51: | ||
|- | |- | ||
|250 | |250 | ||
| | |24.83 | ||
| | |1.22 | ||
|0. | |0.16 | ||
|1. | |1.61 | ||
|- | |- | ||
|500 | |500 | ||
| | |45.48 | ||
| | |1.35 | ||
|0. | |0.41 | ||
|1. | |1.63 | ||
|- | |- | ||
|750 | |750 | ||
| | |68.03 | ||
|1. | |1.42 | ||
|0. | |0.59 | ||
|1. | |1.63 | ||
|- | |- | ||
|1000 | |1000 | ||
| | |90.66 | ||
|1. | |1.74 | ||
|0. | |0.94 | ||
|1. | |1.63 | ||
|- | |- | ||
Line 84: | Line 84: | ||
|} | |} | ||
%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%% | %%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%% | ||
==Low temperature deposition of TiO<sub>2</sub>== | ==Low temperature deposition of TiO<sub>2</sub>== |
Revision as of 16:14, 19 May 2016
This page describes non standart recipes including multilayers structures.
Low temperature deposition of Al2O3
Recipe: Al2O3 LT
Temperature: 80-150 oC
TMA | H2O | |
---|---|---|
Nitrogen flow | 150 sccm | 200 sccm |
Pulse time | 0.1 s | 0.2 s |
Purge time | 5.0 s | 10.0 s |
Deposition rate: 0.089 nm/cycle (@120 oC)
Al2O3 deposition at 120 oC | |||||||||||||||||||||||||||||||
|
%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%
Low temperature deposition of TiO2
Recipe: TiO2 LT
Temperature: 80-150 oC
TiCl4 | H2O | |
---|---|---|
Nitrogen flow | 150 sccm | 200 sccm |
Pulse time | 0.2 s | 0.2 s |
Purge time | 10.0 s | 15.0 s |
Deposition rate: 0.048 nm/cycle (@ 120 oC)
Low temperature grown multilayers on flat surfaces
Recipe: EMA01
Recipe: EMA02
Recipe: EMA03
Recipe: EMA04
Temperature: 120 oC
Al2O3/TiO2 multilayers on high aspect ratio structures
Recipe: Multi T
Temperature: 150 oC
-
Al2O3/TiO2 multilayers grown on silicon trenches.
Evgeniy Shkondin, DTU Danchip, 2014-2016.