Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing/Acceptance test: Difference between revisions

Revision as of 09:51, 12 August 2015

Multipurpose Anneal furnace acceptance test

The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie and Danchip.

At the acceptance test a dry oxide layer was grown on a boat of 150 mm wafers. The oxide growth was repeated three times

For each run the oxide thickness and refractive index were measured on three of the wafers, and the standard deviation and non-uniformity were calculated for each wafer, over the boat and from run to run.

Oxidation parameters

Recipe: "vr_dryOx_1000C_120min_150_5Wafer_D1_mit_Inliner_oPurgering.ATV"

Oxidation time: 80 min

Temperature: 1050 ^oC (all temoperature zones)

O₂ flow: 1 slm

The oxidation has been done with 150 mm wafers, and with 30 wafers in the furnace.

Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured in 13 points on each wafer using the M-2000V ellipsometer.

Results

Oxide thickness

	Date	Wafer 4			Wafer 16			Wafer 28			Center point only
		Average oxide thickness [nm]	St. deviation	Non-uniformity [%]	Average oxide thickness [nm]	St. deviation	Non-uniformity [%]	Average oxide thickness [nm]	St. deviation	Non-uniformity [%]	Average oxide thickness [nm]	St. deviation	Non-uniformity [%]
Run 1	28-01-2015	109.7	1.0	1.7	107.7	0.9	1.1	106.5	0.8	1.2	107.0	2.1	1.9
Run 2	28-01-2015	107.3	1.7	2.4	105.0	1.4	1.7	107.3	0.7	0.9	105.7	1.0	0.9
Run 3	30-01-2015	103.6	0.8	1.1	102.6	0.6	1.2	102.2	0.6	1.1	102.9	1.0	1.0
Average		106.9	1.2	1.7	105.1	1.0	1.3	105.3	0.7	1.1	105.2	1.4	1.3

Run-to-run
Average oxide thickness [nm]	St. deviation	Non-uniformity [%]
105.2	2.1	2.0

Refractive index

	Date	Wafer 4			Wafer 16			Wafer 28			Center point only
		Average refractive index	St. deviation	Non-uniformity [%]	Average refractive index	St. deviation	Non-uniformity [%]	Average refractive index	St. deviation	Non-uniformity [%]	Average refractive index	St. deviation	Non-uniformity [%]
Run 1	28-01-2015	1.46	0.00	0.04	1.46	0.00	0.07	1.46	0.00	0.06	1.4609	0.0004	0.0230
Run 2	28-01-2015	1.46	0.00	0.09	1.46	0.00	0.17	1.44	0.01	0.69	1.4561	0.0094	05873
Run 3	30-01-2015	1.46	0.00	0.06	1.46	0.00	0.05	1.46	0.00	0.07	1.4602	0.0004	0.0291
Average		1.46	0.00	0.06	1.46	0.00	0.10	1.46	0.00	0.27	1.46	0.00	0.21

Run-to-run
Average refractive index	St. deviation	Non-uniformity [%]
1.4591	0.0026	0.1637

@@ Line 1: / Line 1: @@
-The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie.
+==Multipurpose Anneal furnace acceptance test==
-At the acceptance test a dry oxide layers was grown on a boat of 150 mm wafers. The oxide growth was repeated three times
+The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie and Danchip.
-The oxide thickness and refractive index were measured on three of the wafers, and the standard deviation and non-uniformity were calculated for each wafer, over the boat and from run to run.
+At the acceptance test a dry oxide layer was grown on a boat of 150 mm wafers. The oxide growth was repeated three times
+For each run the oxide thickness and refractive index were measured on three of the wafers, and the standard deviation and non-uniformity were calculated for each wafer, over the boat and from run to run.
 ==Oxidation parameters==
@@ Line 12: / Line 14: @@
 '''Oxidation time''': 80 min
-'''Oxidation temperature''': 1050 <sup>o</sup>C (all temoperature zones)
+'''Temperature''': 1050 <sup>o</sup>C (all temoperature zones)
 '''O<sub>2</sub> flow''': 1 slm
-The oxidation has been done with 150 mm wafer, and with 30 wafers in the furnace.
+The oxidation has been done with 150 mm wafers, and with 30 wafers in the furnace.
 Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured in 13 points on each wafer using the M-2000V ellipsometer.
@@ Line 122: / Line 124: @@
 | 2.0
 |}
 ====Refractive index====