Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing/Acceptance test: Difference between revisions

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Recipe: "vr_dryOx_1000C_120min_150_5Wafer_D1_mit_Inliner_oPurgering.ATV"
'''Recipe''': "vr_dryOx_1000C_120min_150_5Wafer_D1_mit_Inliner_oPurgering.ATV"


Oxidation time: 80 min
'''Oxidation time''': 80 min
Oxidation temperature: 1050 <sup>o</sup>C
 
O<sub>2</sub> flow: 1 slm
'''Oxidation temperature''': 1050 <sup>o</sup>C (all temoperature zones)
 
'''O<sub>2</sub> flow''': 1 slm


The oxidation has been done with 150 mm wafer, and with 30 wafers in the furnace.  
The oxidation has been done with 150 mm wafer, and with 30 wafers in the furnace.  
Line 18: Line 20:


==Results==
==Results==
The oxide thickness has been measured in 13 points on each wafer using the M-2000V ellipsometer.


{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|-
|-
! Run number
!  
! Date
! Date
! colspan="3" | Wafer 4
! colspan="3" | Wafer 4
! colspan="3" | Wafer 16
! colspan="3" | Wafer 16
! colspan="3" | Wafer 28
! colspan="3" | Wafer 28
! colspan="3" | Center point only
|-
|-
! width="80" |   
! width="80" |   
Line 31: Line 36:
! width="50" | Average oxide thickness [nm]
! width="50" | Average oxide thickness [nm]
! width="50" | St. deviation  
! width="50" | St. deviation  
! width="50" | Non-uniformity [%]
! width="50" | Average oxide thickness [nm]
! width="50" | St. deviation
! width="50" | Non-uniformity [%]
! width="50" | Non-uniformity [%]
! width="50" | Average oxide thickness [nm]
! width="50" | Average oxide thickness [nm]
Line 50: Line 58:
| 0.8
| 0.8
| 1.2
| 1.2
| 107.0
| 2.1
| 1.9
|-
|-
! Run 2  
! Run 2  
Line 61: Line 72:
| 107.3
| 107.3
| 0.7
| 0.7
| 0.9
| 105.7
| 1.0
| 0.9
| 0.9
|-
|-
Line 74: Line 88:
| 0.6
| 0.6
| 1.1
| 1.1
| 102.9
| 1.0
| 1.0
|-
! Average
|
| 106.9
| 1.2
| 1.7
| 105.1
| 1.0
| 1.3
| 105.3
| 0.7
| 1.1
| 105.2
| 1.4
| 1.3
|-
|-
! Common  
! Common  
| colspan="23" | Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers
| colspan="23" | Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers
|}
|}

Revision as of 09:14, 12 August 2015

THIS PAGE IS UNDER CONSTRUCTION

The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie.



Recipe: "vr_dryOx_1000C_120min_150_5Wafer_D1_mit_Inliner_oPurgering.ATV"

Oxidation time: 80 min

Oxidation temperature: 1050 oC (all temoperature zones)

O2 flow: 1 slm

The oxidation has been done with 150 mm wafer, and with 30 wafers in the furnace.

Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured.

Results

The oxide thickness has been measured in 13 points on each wafer using the M-2000V ellipsometer.

Date Wafer 4 Wafer 16 Wafer 28 Center point only
Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%]
Run 1 28-01-2015 109.7 1.0 1.7 107.7 0.9 1.1 106.5 0.8 1.2 107.0 2.1 1.9
Run 2 28-01-2015 107.3 1.7 2.4 105.0 1.4 1.7 107.3 0.7 0.9 105.7 1.0 0.9
Run 3 30-01-2015 103.6 0.8 1.1 102.6 0.6 1.2 102.2 0.6 1.1 102.9 1.0 1.0
Average 106.9 1.2 1.7 105.1 1.0 1.3 105.3 0.7 1.1 105.2 1.4 1.3
Common Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers
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