Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing/Acceptance test: Difference between revisions

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Line 22: Line 22:
|-
|-
! Run number
! Run number
! Resist etch rate [nm/min]
! Date
! colspan="3" | Wafer 4
! colspan="3" | Wafer 4
! colspan="3" | Wafer 16
! colspan="3" | Wafer 16
Line 40: Line 40:
|-
|-
! Run 1
! Run 1
|  
| 28-01-2015
| 109.7
| 109.7
| 1.0
| 1.0
Line 52: Line 52:
|-
|-
! Run 2  
! Run 2  
|  
| 28-01-2015
| 107.3
| 107.3
| 1.7
| 1.7
Line 64: Line 64:
|-
|-
! Run 3
! Run 3
|  
| 30-01-2015
| 103.6
| 103.6
| 0.8
| 0.8

Revision as of 09:00, 12 August 2015

THIS PAGE IS UNDER CONSTRUCTION

The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie.



Recipe: "vr_dryOx_1000C_120min_150_5Wafer_D1_mit_Inliner_oPurgering.ATV"

Oxidation time: 80 min Oxidation temperature: 1050 oC O2 flow: 1 slm

The oxidation has been done with 150 mm wafer, and with 30 wafers in the furnace.

Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured.

Results

Run number Date Wafer 4 Wafer 16 Wafer 28
Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%]
Run 1 28-01-2015 109.7 1.0 1.7 107.7 0.9 1.1 106.5 0.8 1.2
Run 2 28-01-2015 107.3 1.7 2.4 105.0 1.4 1.7 107.3 0.7 0.9
Run 3 30-01-2015 103.6 0.8 1.1 102.6 0.6 1.2 102.2 0.6 1.1
Common Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers
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