Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions

Revision as of 13:19, 20 February 2008

Cleaning of wafers or masks with sulphuric acid can be done either in a dedicated tank "7-up" or in the fumehood in a beaker "Piranha":

	7-up	Piranha
General description	Cleaning of wafers or masks using the dedicated tanks.	Cleaning of wafers or masks using a beaker in the fumehood.
Chemical solution	98% Sulfuricacid and Ammoniumsulfat	98% Sulfuricacid and Hydrogenperoxide 4:1
Process temperature	80 ^oC	~70 ^oC
Possible masking materials	None	None
Etch rate	Cleaning only	Cleaning only
Batch size	25 4" wafers or 5 masks at a time	1-5 4" wafer at a time
Size of substrate	4-6" wafers	2-4" wafers

@@ Line 9: / Line 9: @@
 |'''General description'''
 |
-Cleaning of wafers or masks using the dedicated tank.
+Cleaning of wafers or masks using the dedicated tanks.
 |
 Cleaning of wafers or masks using a beaker in the fumehood.
 |-
 |'''Chemical solution'''
+|98% Sulfuricacid and Ammoniumsulfat
 |98% Sulfuricacid and Hydrogenperoxide 4:1
-|HCl:HNO<math>_3</math>  (3:1)
 |-
 |'''Process temperature'''
@@ Line 26: / Line 26: @@
 |'''Possible masking materials'''
 |
-Photoresist (1.5 µm AZ5214E)
+None
 |
-Unmasked - used as a stripper
+None
 |-
 |'''Etch rate'''
 |
-~100 nm/min
+Cleaning only
 |
-~(??) nm/min - fast etch
+Cleaning only
 |-
 |'''Batch size'''
 |
--5  4" wafers at a time
+4" wafers or 5 masks at a time
 |
 -5 4" wafer at a time
@@ Line 44: / Line 44: @@
 |'''Size of substrate'''
 |
 -6" wafers
 |
--6" wafers
+-4" wafers
 |-
 |}