Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions
Line 13: | Line 13: | ||
! Chromium etch 2 | ! Chromium etch 2 | ||
|- | |- | ||
!General description | ! General description | ||
| | | | ||
Etch of chromium | Etch of chromium | ||
Line 19: | Line 19: | ||
Etch of chromium | Etch of chromium | ||
|- | |- | ||
!Chemical solution | ! Chemical solution | ||
|HNO<math>_3</math>:H<math>_2</math>O:cerisulphate - 90ml:1200ml:15g | |HNO<math>_3</math>:H<math>_2</math>O:cerisulphate - 90ml:1200ml:15g | ||
|Commercial chromium etch | |Commercial chromium etch | ||
CE 8002-A | CE 8002-A | ||
|- | |- | ||
!Process temperature | ! Process temperature | ||
|Room temperature | |Room temperature | ||
Line 31: | Line 31: | ||
|- | |- | ||
!Possible masking materials: | ! Possible masking materials: | ||
| | | | ||
Photoresist (1.5 µm AZ5214E) | Photoresist (1.5 µm AZ5214E) |
Revision as of 12:56, 31 January 2008
Etching of Chromium
Etching of chromium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:
- HNO:HO:cerisulphate - 90ml:1200ml:15g - standard at Danchip
- Commercial chromium etch
Etch rate are depending on the level of oxidation of the metal.
Chromium etch 1 | Chromium etch 2 | |
---|---|---|
General description |
Etch of chromium |
Etch of chromium |
Chemical solution | HNO:HO:cerisulphate - 90ml:1200ml:15g | Commercial chromium etch
CE 8002-A |
Process temperature | Room temperature | Room temperature |
Possible masking materials: |
Photoresist (1.5 µm AZ5214E) |
Photoresist (1.5 µm AZ5214E) |
Etch rate |
~40-100 nm/min |
~10-20 nm/min |
Batch size |
1-25 wafers at a time |
1-25 wafer at a time |
Size of substrate |
4" wafers |
4" wafers |
Allowed materials |
No restrictions. Make a note on the beaker of which materials have been processed. |
No restrictions. Make a note on the beaker of which materials have been processed. |