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Specific Process Knowledge/Lithography/Baking: Difference between revisions

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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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Film or pattern of all types
Film or pattern of all types
|
|
*Silicon
Silicon, glass, and polymer substrates
*Poly Silicon
 
*Silicon Oxide
Film or pattern of all types except type IV
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*Blue film
|
|
*Silicon
All substrates
*Silicon Oxide
 
*Silicon Nitride
Film or pattern of all types
*Glass
|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|
Silicon, glass, and high Tg polymer substrates
 
Film or pattern of all types except resist
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Restrictions
!Restrictions
|Type IV and resist/polymer on polymer substrate
|
|Wafers with metal is not allowed
|III-V, copper, steel substrates and Pb, Te films
|Information is given at the individual hotplate
|III-V substrates and Pb, Te films
|III-V, copper, steel substrates
|Resist is not allowed
|Resist is not allowed
|-
|-
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