Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions

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|Allowed materials
|Allowed materials
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*Aluminium
No restrictions
*Silicon
Make a note on the beaker of which materials have been processed.
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
|
|
*Aluminium
No restrictions
*Silicon
Make a note on the beaker of which materials have been processed.
*Silicon Oxide
*Silicon Nitride
*Silicon Oxynitride
*Photoresist
*E-beam resist
|-
|-
|}
|}

Revision as of 09:23, 31 January 2008

Etching of Chromium

Etching of chromium is done wet at Danchip making your own set up in a beaker in a fumehood - preferably in cleanroom 2 or 4. We have two solution for this:

  1. HNO:HO:cerisulphate - 90ml:1200ml:15g - standard at Danchip
  2. Commercial chromium etch

Etch rate are depending on the level of oxidation of the metal.


Chromium etch 1 Chromium etch 2
General description

Etch of chromium

Etch of chronium

Chemical solution HNO:HO:cerisulphate - 90ml:1200ml:15g Commercial chromium etch

CE 8002-A

Process temperature Room temperature Room temperature
Possible masking materials:

Photoresist (1.5 µm AZ5214E)

Photoresist (1.5 µm AZ5214E)

Etch rate

~40-100 nm/min

~10-20 nm/min

Batch size

1-25 wafers at a time

1-25 wafer at a time

Size of substrate

4" wafers

4" wafers

Allowed materials

No restrictions Make a note on the beaker of which materials have been processed.

No restrictions Make a note on the beaker of which materials have been processed.