Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al: Difference between revisions
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=====Set-up===== | =====Set-up===== | ||
Two "boats" of Tantalum are mounted (on top of each other) in the thermal source each time. | * Two "boats" of Tantalum are mounted (on top of each other) in the thermal source each time. | ||
If the last deposition from the source was Aluminum, the same boats can be used, otherwise they should be changed. | * If the last deposition from the source was Aluminum, the same boats can be used, otherwise they should be changed. | ||
"Small" Al pellets (diameter 1/8", height 1/8") are used. Use these small pellets to get a more uniform deposition with stable deposition rate. | * "Small" Al pellets (diameter 1/8", height 1/8") are used. Use these small pellets to get a more uniform deposition with stable deposition rate. | ||
=====Program settings===== | =====Program settings===== |
Revision as of 11:36, 16 October 2014
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Thermal evaporation of Aluminum
Aluminum can be thermally evaporated in Wordentec. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.
Recipe
Use process 9 in Wordentec to deposit thermal Aluminum.
Observe: you need to be specially trained to use the thermal deposition source.
Set-up
- Two "boats" of Tantalum are mounted (on top of each other) in the thermal source each time.
- If the last deposition from the source was Aluminum, the same boats can be used, otherwise they should be changed.
- "Small" Al pellets (diameter 1/8", height 1/8") are used. Use these small pellets to get a more uniform deposition with stable deposition rate.
Program settings
Deposition rate is normally 1 or 2 Å/s.
The settings saved in the material file for thermal aluminum are these:
Soak power 1: 5%
Soak power 2: 7%
These are already saved in the process.