Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al: Difference between revisions
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== '''Thermal evaporation of | == '''Thermal evaporation of Aluminum''' == | ||
Aluminum can be thermally evaporated in [[Specific Process Knowledge/Thin_film_deposition/Wordentec|Wordentec]]. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. | |||
For deposition onto the unexposed e-beam resist, you need to use the thermal source. | For deposition onto the unexposed e-beam resist, you need to use the thermal source. | ||
===Recipe=== | |||
Use '''process 9''' in Wordentec to deposit thermal Aluminum. | |||
''Observe: you need to be specially trained to use the thermal deposition source.'' | ''Observe: you need to be specially trained to use the thermal deposition source.'' | ||
=====Set up===== | |||
=====Program settings===== | |||
The settings saved in the material file for thermal aluminum are these: | |||
Soak power 1: 5% | |||
Soak power 2: 7% | |||
These are already saved in the process. | |||
There is a general page concerning different methods of depositing [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium]] at Danchip. | There is a general page concerning different methods of depositing [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium]] at Danchip. |
Revision as of 11:09, 16 October 2014
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Thermal evaporation of Aluminum
Aluminum can be thermally evaporated in Wordentec. At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.
Recipe
Use process 9 in Wordentec to deposit thermal Aluminum.
Observe: you need to be specially trained to use the thermal deposition source.
Set up
Program settings
The settings saved in the material file for thermal aluminum are these: Soak power 1: 5% Soak power 2: 7% These are already saved in the process.
There is a general page concerning different methods of depositing Aluminium at Danchip.