Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al: Difference between revisions
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Set-up | |||
''Observe: you need to be specially trained to use the thermal deposition source.'' | |||
Program settings | |||
There is a general page concerning different methods of depositing [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium]] at Danchip. | There is a general page concerning different methods of depositing [[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium]] at Danchip. |
Revision as of 11:01, 16 October 2014
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Thermal evaporation of Aluminium
Aluminium can be thermally evaporated in Wordentec . At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.
Set-up
Observe: you need to be specially trained to use the thermal deposition source.
Program settings
There is a general page concerning different methods of depositing Aluminium at Danchip.