Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Thermal deposition of Al: Difference between revisions

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Aluminium can be thermally evaporated in [[Specific Process Knowledge/Thin_film_deposition/Wordentec|Wordentec]] . At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure.
 
For deposition onto the unexposed e-beam resist, you need to use the thermal source.




Revision as of 10:57, 16 October 2014


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Thermal evaporation of Aluminium

Aluminium can be thermally evaporated in Wordentec . At DTU Danchip, we recommend to use a thin layer of thermally evaporated aluminum on top of e-beam resist, before the e-beam exposure. For deposition onto the unexposed e-beam resist, you need to use the thermal source.





There is a general page concerning different methods of depositing Aluminium at Danchip.

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