Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
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* gas in chamber (Ar, N2, O2 or mixture). | * gas in chamber (Ar, N2, O2 or mixture). | ||
In the tabel below there a given a list of relative sputter rates for different materials (Al is set to 1). | In the tabel below ([[Sputtering rates]]) there a given a list of relative sputter rates for different materials (Al is set to 1). | ||
This means that You can estimate the sputter rate for a new material if you have the rate for another material under the same conditions. | This means that You can estimate the sputter rate for a new material if you have the rate for another material under the same conditions. | ||
I think this only works for non-reactive sputtering (i.e. with Ar as the gas). | I think this only works for non-reactive sputtering (i.e. with Ar as the gas). | ||