Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions
No edit summary |
|||
| Line 7: | Line 7: | ||
== Deposition of Silver == | == Deposition of Silver == | ||
Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment. | Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment. | ||
== Sputter deposition of Silver == | |||
* [[/Sputter rates for Ag PVD co-sputter/evaporation|Sputter deposition of Silver in PVD so-sputter/evaporation]]. | |||
== Thermal deposition of Silver == | |||
* [[/Deposition of Silver|Thermal deposition of Silver in Wordentec]] | |||
| Line 141: | Line 152: | ||
'''*''' ''For thicknesses above 200 nm permission is required.'' | '''*''' ''For thicknesses above 200 nm permission is required.'' | ||