Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

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! Sputter deposition (Wordentec)
! Sputter deposition (Wordentec)
|-style="background:WhiteSmoke; color:black"  
|-style="background:WhiteSmoke; color:black"  
! General description
| Sputter deposition of TiW
|-
|-style="background:LightGrey; color:black"
! Pre-clean
|RF Ar clean
|-
|-style="background:WhiteSmoke; color:black"
! Layer thickness
|.
|-
|-style="background:LightGrey; color:black"
! Deposition rate
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
|-
|-style="background:WhiteSmoke; color:black"
! Batch size
! Batch size
|
|
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*6x4" wafers or
*6x4" wafers or
*6x6" wafers
*6x6" wafers
|-


|-style="background:LightGrey; color:black"
! Pre-clean
|RF Ar clean
|-style="background:WhiteSmoke; color:black"
! Layer thickness
|.
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Allowed substrates
! Allowed substrates
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* SU-8  
* SU-8  
* Metals  
* Metals  
|-


|-style="background:LightGrey; color:black"


! Deposition rate
|-style="background:LightGrey;  color:black"
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
|-
|-style="background:WhiteSmoke;  color:black"
! Comments
! Comments
| TiW alloy: 10%/90% by weight
| TiW alloy: 10%/90% by weight

Revision as of 10:00, 26 March 2014

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Deposition of TiW alloy can take place in the Wordentec.


Observe: right now we don´t have a TiW target for Wordentec, please contact thinfilm@danchip.dtu.dk if you are interested in depositing TiW.

Sputter deposition (Wordentec)
General description Sputter deposition of TiW
Pre-clean RF Ar clean
Layer thickness .
Deposition rate Depending on process parameters, see here.
Batch size
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Allowed substrates
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
Comments TiW alloy: 10%/90% by weight


Deposited rates

This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see here) and may change with these settings.


Deposited film characteristics

AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here.

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