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Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

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! Sputter deposition (Wordentec)
! Sputter deposition (Wordentec)
|-style="background:WhiteSmoke; color:black"  
|-style="background:WhiteSmoke; color:black"  
! General description
| Sputter deposition of TiW
|-
|-style="background:LightGrey; color:black"
! Pre-clean
|RF Ar clean
|-
|-style="background:WhiteSmoke; color:black"
! Layer thickness
|.
|-
|-style="background:LightGrey; color:black"
! Deposition rate
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
|-
|-style="background:WhiteSmoke; color:black"
! Batch size
! Batch size
|
|
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*6x4" wafers or
*6x4" wafers or
*6x6" wafers
*6x6" wafers
|-


|-style="background:LightGrey; color:black"
! Pre-clean
|RF Ar clean
|-style="background:WhiteSmoke; color:black"
! Layer thickness
|.
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Allowed substrates
! Allowed substrates
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* SU-8  
* SU-8  
* Metals  
* Metals  
|-


|-style="background:LightGrey; color:black"


! Deposition rate
|-style="background:LightGrey;  color:black"
|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
|-
|-style="background:WhiteSmoke;  color:black"
! Comments
! Comments
| TiW alloy: 10%/90% by weight
| TiW alloy: 10%/90% by weight
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