Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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 '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
-Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
+Gold can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.
 {| border="1" cellspacing="0" cellpadding="4"
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 |-style="background:WhiteSmoke; color:black"
-! Batch size
+! General description
-|
+| E-beam deposition of Au
-*Up to 1x4" wafers
+| E-beam deposition of Au
-*smaller pieces
+| Sputter deposition of Au
-|
+| Sputter deposition of Au
-*24x2" wafers or
+| Sputter deposition of Au
-*6x4" wafers or
-*6x6" wafers
-|
-*Pieces or
-*1x4" wafer or
-*1x6" wafer
-|
-*1x4" wafer
-*Several smaller samples
-|
-*1 large sample (< 4" wafer)
-*Several smaller samples
 |-
 |-style="background:LightGrey; color:black"
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 |
 |
+|-
 |-style="background:LightGrey; color:black"
 ! Deposition rate
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 |Not measured
 |Not measured
+|-
 |-style="background:WhiteSmoke; color:black"
+! Batch size
+|
+*Up to 1x4" wafers
+*smaller pieces
+|
+*24x2" wafers or
+*6x4" wafers or
+*6x6" wafers
+|
+*Pieces or
+*1x4" wafer or
+*1x6" wafer
+|
+*1x4" wafer
+*Several smaller samples
+|
+*1 large sample (< 4" wafer)
+*Several smaller samples
+|-
+|-style="background:LightGrey; color:black"
 !Allowed materials
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 |.
-|-style="background:LightGrey; color:black"
+|-style="background:WhiteSmoke; color:black"
 ! Comment
 |For thicknesses above 200 nm