Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions
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! | ! General description | ||
| | | E-beam deposition of Sn | ||
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|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
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!Pre-clean | |||
|RF Ar clean | |||
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! Batch size | |||
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*Up to 1x4" wafers | |||
*smaller pieces | |||
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!Allowed materials | !Allowed materials | ||