Specific Process Knowledge/Thin film deposition/Deposition of Titanium Oxide: Difference between revisions

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 |
 *
+|-
+|}
+{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+|-
+|-
+|-style="background:silver; color:black"
+!
+!Sputter technique using [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab300]]
+![[Specific Process Knowledge/Thin film deposition/PECVD|Sputter System Lesker
+]]
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Generel description
+|Generel description - method 1
+|Generel description - method 2
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Parameter 1
+|
+*A
+*B
+|
+*A
+*B
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!Parameter 2
+|
+*A
+*B
+*C
+|
+*A
+|-
+|-
+|-style="background:LightGrey; color:black"
+!Substrate size
+|
+*<nowiki>#</nowiki> small samples
+*<nowiki>#</nowiki> 50 mm wafers
+*<nowiki>#</nowiki> 100 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers
+|
+*<nowiki>#</nowiki> small samples
+*<nowiki>#</nowiki> 50 mm wafers
+*<nowiki>#</nowiki> 100 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers
+|-
+|-
+|-style="background:WhiteSmoke; color:black"
+!'''Allowed materials'''
+|
+*Allowed material 1
+*Allowed material 2
+|
+*Allowed material 1
+*Allowed material 2
+*Allowed material 3
 |-
 |}