Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

Revision as of 16:02, 6 March 2014

4th Level - Comparison

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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	Sputter (Lesker)	Sputter coater Hummer	Sputter coater Balzer
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	up to 1x6" wafer	1x4" wafer Several smaller samples	1 large sample (< 4" wafer) Several smaller samples
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean
Layer thickness	10 Å to 5000Å*	10 Å to 5000Å*	10 Å to
Deposition rate	2 Å/s to 10 Å/s	1 Å/s to 10 Å/s		Not measured	Not measured
Comment	For thicknesses above 200 nm permission is required	For thicknesses above 200 nm permission is required		Used to gold sputter coating of samples mainly before SEM characterization	Used to gold sputter coating of samples mainly before SEM characterization

* For thicknesses above 200 nm permission from ThinFilm group (thinfilm@danchip.dtu.dk) is required.

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings

@@ Line 15: / Line 15: @@
 |-style="background:WhiteSmoke; color:black"
-| Batch size
+! Batch size
 |
 *Up to 1x4" wafers
@@ Line 33: / Line 33: @@
 |-
 |-style="background:LightGrey; color:black"
-| Pre-clean
+! Pre-clean
 |RF Ar clean
 |RF Ar clean
@@ Line 40: / Line 40: @@
 |
 |-style="background:WhiteSmoke; color:black"
-| Layer thickness
+! Layer thickness
 |10 Å to 5000Å*
 |10 Å to 5000Å*
@@ Line 47: / Line 47: @@
 |
 |-style="background:LightGrey; color:black"
-| Deposition rate
+! Deposition rate
 |2 Å/s to 10 Å/s
 |1 Å/s to 10 Å/s
@@ Line 55: / Line 55: @@
 |-style="background:WhiteSmoke; color:black"
-| Comment
+! Comment
 |For thicknesses above 200 nm
 permission is required