Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Batch size | |||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | |||
|10 Å to 5000Å* | |10 Å to 5000Å* | ||
|10 Å to 5000Å* | |10 Å to 5000Å* | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | |||
|2 Å/s to 10 Å/s | |2 Å/s to 10 Å/s | ||
|1 Å/s to 10 Å/s | |1 Å/s to 10 Å/s | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Comment | |||
|For thicknesses above 200 nm | |For thicknesses above 200 nm | ||
permission is required | permission is required | ||