Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
Appearance
No edit summary |
|||
| Line 93: | Line 93: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Comment | ! Comment | ||
| Thicknesses above | | Thicknesses above 2000 Å requires special permission | ||
| | | | ||
*[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | *[[/Stress Wordentec Ni films|Stress in Wordentec Ni films: study here]]. | ||
*Thicknesses above | *Thicknesses above 2000 Å requires special permission | ||
|Only very thin layers (up to 100nm). | |Only very thin layers (up to 100nm). | ||
|Sample must be compatible with plating bath. Seed metal necessary. | |Sample must be compatible with plating bath. Seed metal necessary. | ||
| Line 103: | Line 103: | ||
|} | |} | ||
'''*''' ''To deposit layers thicker then | '''*''' ''To deposit layers thicker then 2000 Å permission is required (contact Thin film group)'' | ||