Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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<center><span style="background:#87CEEB">4th Level - Comparison</span></center> | <center><span style="background:#87CEEB">4th Level - Comparison</span></center> | ||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]''' | ||
Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | ||
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! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter (Lesker) | ! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
! Sputter coater Hummer | ! Sputter coater [[Specific Process Knowledge/Thin film deposition/Sputter coater|Hummer]] | ||
! Sputter coater Balzer | ! Sputter coater Balzer | ||
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| Batch size | | Batch size | ||
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*Several smaller samples | *Several smaller samples | ||
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| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
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| Layer thickness | | Layer thickness | ||
|10 Å to 5000Å* | |10 Å to 5000Å* | ||
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| Deposition rate | | Deposition rate | ||
|2 Å/s to 15 Å/s | |2 Å/s to 15 Å/s | ||