Specific Process Knowledge/Thin film deposition/Deposition of NiV: Difference between revisions
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*4x6" wafers | *4x6" wafers | ||
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*Pieces or | |||
*1x4" wafer or | *1x4" wafer or | ||
*1x6" wafer | *1x6" wafer | ||
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! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
| | | | ||
|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
! Layer thickness | ! Layer thickness | ||
|About 10Å to 4000Å | |About 10Å to 4000Å | ||
| | |About 10Å to 5000Å | ||
|- | |- | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
| Line 51: | Line 52: | ||
* Metals | * Metals | ||
| | | | ||
* Silicon | * Silicon | ||
* | * Silicon oxide | ||
* Silicon nitride | |||
* Silicon (oxy)nitride | |||
* Photoresist | |||
* PMMA | |||
* Mylar | |||
* SU-8 | |||
* Metals | |||
* Carbon | |||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||