Specific Process Knowledge/Wafer cleaning/7-up & Piranha: Difference between revisions
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'''Feedback to this page''': '''[mailto:wetchemistry@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/Wet_Silicon_Nitride_Etch click here]''' | |||
==Cleaning of wafers or masks== | ==Cleaning of wafers or masks== | ||
[[Image:7-up_RR3.jpg|300x300px|right|thumb|7-up 4": positioned in cleanroom 3<br\> -Up to 19 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi]] | [[Image:7-up_RR3.jpg|300x300px|right|thumb|7-up 4": positioned in cleanroom 3<br\> -Up to 19 wafers of 4" at a time.<br\> -Materials allowed: Silicon, Silicon oxide, Silicon nitride, PolySi]] | ||