Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions

Revision as of 12:46, 8 May 2013

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Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	E-beam evaporation (PVD co-sputter/evaporation)	Electroplating (Electroplating-Ni/electrochemical deposition)
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	12x2" wafers or 12x4" wafers or 4x6" wafers	1x2" wafer or 1x4" wafer or 1x6" wafer
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean	None
Layer thickness	10Å to 1µm	10Å to 1 µm	10Å to 1000 Å	A few µm to 1400 µm
Deposition rate	2Å/s to 15Å/s	10Å/s to 15Å/s	About 1Å/s	About 1 to 200Å/s
Comment			Only very thin layers (up to 100nm).	Sample must be compatible with plating bath. Seed metal necessary.

@@ Line 43: / Line 43: @@
 |10Å to 1 µm
 |10Å to 1000 Å
-|A few µm to 1500 µm
+|A few µm to 1400 µm
 |-
@@ Line 50: / Line 50: @@
 |10Å/s to 15Å/s
 |About 1Å/s
-|About 1 - 1400Å/s
+|About 1 to 200Å/s
 |-
 |-