Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions

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Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Wordentec)	E-beam evaporation (PVD co-sputter/evaporation)	Electroplating (Electroplating-Ni/electrochemical deposition)
Batch size	Up to 1x4" wafers smaller pieces	24x2" wafers or 6x4" wafers or 6x6" wafers	12x2" wafers or 12x4" wafers or 4x6" wafers	1x2" wafer or 1x4" wafer or 1x6" wafer
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean	None
Layer thickness	10Å to 1µm	10Å to 1 µm	10Å to 1000 Å	A few µm to 1500 µm
Deposition rate	2Å/s to 15Å/s	10Å/s to 15Å/s	About 1Å/s	About 1 - 1400Å/s
Comment			Only very thin layers (up to 100nm).	Sample must be compatible with plating bath. Seed metal necessary.

@@ Line 12: / Line 12: @@
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
-! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni/electrochemical deposition]])
+! Electroplating ([[Specific Process Knowledge/Thin film deposition/Electroplating-Ni|Electroplating-Ni/electrochemical deposition]])
 |-
 | Batch size
@@ Line 58: / Line 58: @@
 |
 |Only very thin layers (up to 100nm).
+|Sample must be compatible with plating bath. Seed metal necessary.
 |-
 |}