Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions
No edit summary |
|||
| Line 41: | Line 41: | ||
|About 1Å/s | |About 1Å/s | ||
|- | |- | ||
|- | |||
|-style="background:WhiteSmoke; color:black" | |||
! Comment | |||
| | |||
| | |||
|Only very thin layers (up to 100nm). | |||
|- | |||
|} | |} | ||
Revision as of 10:26, 11 March 2013
Feedback to this page: click here
Nickel deposition
Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1 µm | 10Å to 1000 Å |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s |
| Comment | Only very thin layers (up to 100nm). |