Specific Process Knowledge/Thin film deposition/Deposition of Nickel: Difference between revisions

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|10Å to 1µm  
|10Å to 1µm  
|10Å to 1 µm
|10Å to 1 µm
|10Å to 1000 Å
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| Deposition rate
| Deposition rate
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|10Å/s to 15Å/s
|10Å/s to 15Å/s
|About 1Å/s
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Revision as of 14:12, 1 March 2013

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Nickel deposition

Nickel can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec) E-beam evaporation (PVD co-sputter/evaporation)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • 12x2" wafers or
  • 12x4" wafers or
  • 4x6" wafers
Pre-clean RF Ar clean RF Ar clean RF Ar clean
Layer thickness 10Å to 1µm 10Å to 1 µm 10Å to 1000 Å
Deposition rate 2Å/s to 15Å/s 10Å/s to 15Å/s About 1Å/s