Specific Process Knowledge/Etch: Difference between revisions

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'''Advantages of dry etch over wet chemistry:'''
'''Advantages of dry etch over wet chemistry:'''
*Anisotropic etch can be done.
*Anisotropic etch can be done.
*The etch do not attach the backside of the sample.
*The etch does not attach the backside of the sample.


== Choose material to be etched ==
== Choose material to be etched ==

Revision as of 10:24, 10 December 2012

Wet etch or dry etch

Etching at Danchip can be done either with wet chemistry or in dry etch equipment. In general wet chemistry etches isotropically in most materials were as dry etch techniques can be optimized to transfer a given mask pattern with vertical sidewalls (anisotropically) to a given substrate.

Advantages of wet chemistry over dry etch techniques are:

  • An often high etch rate difference of different materials giving raise to a high selectivity of the material to be etched compared to underlaying layers or mask materials.
  • Time saving: You can often etch 25 wafers at a time in wet chemistry where as dry etch equipment can only handle one wafer at a time.
  • Easy to start up new etch solutions.

Advantages of dry etch over wet chemistry:

  • Anisotropic etch can be done.
  • The etch does not attach the backside of the sample.

Choose material to be etched

Choose a dry etch equipment

Choose a wet etch