Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
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| Line 7: | Line 7: | ||
! E-beam evaporation (Leybold) | ! E-beam evaporation (Leybold) | ||
! E-beam evaporation (Wordentec) | ! E-beam evaporation (Wordentec) | ||
! Sputter deposition (Wordentec) | |||
|- | |- | ||
| Batch size | | Batch size | ||
| Line 15: | Line 16: | ||
*8x4" wafers or | *8x4" wafers or | ||
*5x6" wafers | *5x6" wafers | ||
| | |||
*24x2" wafers or | |||
*6x4" wafers or | |||
*6x6" wafers | |||
| | | | ||
*24x2" wafers or | *24x2" wafers or | ||
| Line 23: | Line 28: | ||
|RF Ar clean | |RF Ar clean | ||
|Ar ion bombartment | |Ar ion bombartment | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
|- | |- | ||
| Line 29: | Line 35: | ||
|10Å to 0.5µm | |10Å to 0.5µm | ||
|10Å to 1 µm | |10Å to 1 µm | ||
|. | |||
|- | |- | ||
| Deposition rate | | Deposition rate | ||
| Line 34: | Line 41: | ||
|1Å/s to 5Å/s | |1Å/s to 5Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|. | |||
|- | |- | ||
|} | |} | ||
Revision as of 11:37, 19 December 2007
Titanium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | |
|---|---|---|---|---|
| Batch size |
|
|
|
|
| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 1 µm | . |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 10Å/s to 15Å/s | . |